LFBGA packaging stress measurements with piezoresistive sensors.

Authors :: Ben-Je Lwo
Kun-Fu Tseng
Chin-Hsing Kao
Tung-Sheng Chen
Jeng-Shian Su
Source :: Proceedings of the 4th International Symposium on Electronic Materials & Packaging, 2002; 2002, p482-487, 6p
Publication Year :: 2002

Language :: English
ISBNs :: 9780780376823
Database :: Complementary Index
Journal :: Proceedings of the 4th International Symposium on Electronic Materials & Packaging, 2002
Publication Type :: Conference
Accession number :: 81653402
Full Text :: https://doi.org/10.1109/EMAP.2002.1188887