A multi-story power delivery technique for 3D integrated circuits.

Authors :: Jain, P.
Tae-Hyoung Kim
Keane, J.
Kim, C.H.
Source :: 2008 ACM/IEEE International Symposium on Low Power Electronics & Design (ISLPED); 2008, p57-62, 6p
Publication Year :: 2008

Language :: English
ISBNs :: 9781424486342
Database :: Complementary Index
Journal :: 2008 ACM/IEEE International Symposium on Low Power Electronics & Design (ISLPED)
Publication Type :: Conference
Accession number :: 81627494
Full Text :: https://doi.org/10.1145/1393921.1393940