Modeling and analysis of die-to-die vertical coupling in 3-D IC.

MLA

Sangrok Lee, et al. “Modeling and Analysis of Die-to-Die Vertical Coupling in 3-D IC.” 11th Electronics Packaging Technology Conference, 2009. EPTC ’09, Jan. 2009, pp. 707–11. EBSCOhost, https://doi.org/10.1109/EPTC.2009.5416459.

APA

Sangrok Lee, Gawon Kim, Jaemin Kim, Taigon Song, Junho Lee, Hyungdong Lee, Kunwoo Park, & Joungho Kim. (2009). Modeling and analysis of die-to-die vertical coupling in 3-D IC. 11th Electronics Packaging Technology Conference, 2009. EPTC ’09, 707–711. https://doi.org/10.1109/EPTC.2009.5416459

Chicago

Sangrok Lee, Gawon Kim, Jaemin Kim, Taigon Song, Junho Lee, Hyungdong Lee, Kunwoo Park, and Joungho Kim. 2009. “Modeling and Analysis of Die-to-Die Vertical Coupling in 3-D IC.” 11th Electronics Packaging Technology Conference, 2009. EPTC ’09, January, 707–11. doi:10.1109/EPTC.2009.5416459.