Reliability study of low cost alternative Ag bonding wire with various bond pad materials.

Details

Language :

English

ISBNs :

9781424450992

Database :

Complementary Index

Journal :

11th Electronics Packaging Technology Conference, 2009. EPTC '09

Publication Type :

Conference

Accession number :

81603308

Full Text :

https://doi.org/10.1109/EPTC.2009.5416424