Suppression of stress-induced voiding in copper interconnects.

MLA

Oshima, T., et al. “Suppression of Stress-Induced Voiding in Copper Interconnects.” Digest. International Electron Devices Meeting, Jan. 2002, pp. 757–60. EBSCOhost, https://doi.org/10.1109/IEDM.2002.1175948.

APA

Oshima, T., Hinode, K., Yamaguchi, H., Aoki, H., Torii, K., Saito, T., Ishikawa, K., Noguchi, J., Fukui, M., Nakamura, T., Uno, S., Tsugane, K., Murata, J., Kikushima, K., Sekisaka, H., Murakami, E., Okuyama, K., & Iwasaki, T. (2002). Suppression of stress-induced voiding in copper interconnects. Digest. International Electron Devices Meeting, 757–760. https://doi.org/10.1109/IEDM.2002.1175948

Chicago

Oshima, T., K. Hinode, H. Yamaguchi, H. Aoki, K. Torii, T. Saito, K. Ishikawa, et al. 2002. “Suppression of Stress-Induced Voiding in Copper Interconnects.” Digest. International Electron Devices Meeting, January, 757–60. doi:10.1109/IEDM.2002.1175948.