True influence of wafer-backside copper contamination during the back-end process on device characteristics.

Details

Language :

English

ISBNs :

9780780374621

Database :

Complementary Index

Journal :

Digest. International Electron Devices Meeting

Publication Type :

Conference

Accession number :

81599337

Full Text :

https://doi.org/10.1109/IEDM.2002.1175943