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A complete stress enhancement model development and verification platform for 32nm technology and beyond.

Authors :
Yanfeng Li
Nengyong Zhu
Miao Li
Yanjun Wu
Qiang Chen
Shuang Cai
Radojcic, R.
Nakamoto, M.
Source :
2010 10th IEEE International Conference on Solid-State & Integrated Circuit Technology (ICSICT); 2010, p1871-1873, 3p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424457977
Database :
Complementary Index
Journal :
2010 10th IEEE International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
Publication Type :
Conference
Accession number :
81572009
Full Text :
https://doi.org/10.1109/ICSICT.2010.5667735