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Novel pore-sealing of ordered, porous silica, SBA-15 for low-k underfill materials.

Authors :
Kuo-Yuan Hsu
Kuei-Yue Chen
Ching-Yuan Cheng
Jhih-Jhao Lee
Jihperng Leu
Source :
2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p520-525, 6p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424446582
Database :
Complementary Index
Journal :
2009 International Conference on Electronic Packaging Technology & High Density Packaging
Publication Type :
Conference
Accession number :
81511942
Full Text :
https://doi.org/10.1109/ICEPT.2009.5270695