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Active circuit to through silicon via (TSV) noise coupling.
- Source :
- 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging & Systems; 2009, p97-100, 4p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424444472
- Database :
- Complementary Index
- Journal :
- 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging & Systems
- Publication Type :
- Conference
- Accession number :
- 81455120
- Full Text :
- https://doi.org/10.1109/EPEPS.2009.5338469