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Fast full wave analysis of PCB via arrays with model-to-hardware correlation.

Authors :
Xiaoxiong Gu
Boping Wu
Baks, C.
Tsang, L.
Source :
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging & Systems; 2009, p175-178, 4p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424444472
Database :
Complementary Index
Journal :
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging & Systems
Publication Type :
Conference
Accession number :
81455099
Full Text :
https://doi.org/10.1109/EPEPS.2009.5338448