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Cost effective, mass productive Wafer-Level Chip Size Package (WLCSP) technology applied to Ku-band frequency converters.

Authors :
Fujita, S.
Imagawa, M.
Satoh, T.
Tokumitsu, T.
Hasegawa, Y.
Source :
Microwave Conference Proceedings (APMC), 2010 Asia-Pacific; 2010, p1212-1215, 4p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424475902
Database :
Complementary Index
Journal :
Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
Publication Type :
Conference
Accession number :
81454783

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