Nonlinearities in thin-silicon die strength tests.

Authors :: Huang, P.S.
Tsai, M.Y.
Source :: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p91-95, 5p
Publication Year :: 2011

Language :: English
ISBNs :: 9781457713873
Database :: Complementary Index
Journal :: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International
Publication Type :: Conference
Accession number :: 81451682
Full Text :: https://doi.org/10.1109/IMPACT.2011.6117278