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Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding.
- Source :
- Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p419-422, 4p
- Publication Year :
- 2011
Details
- Language :
- English
- ISBNs :
- 9781457713873
- Database :
- Complementary Index
- Journal :
- Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International
- Publication Type :
- Conference
- Accession number :
- 81451647
- Full Text :
- https://doi.org/10.1109/IMPACT.2011.6117243