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Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement.

Authors :
Huang, P.S.
Lin, Y.H.
Huang, C.Y.
Tsai, M.Y.
Huang, T.C.
Liao, M.C.
Source :
Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424497836
Database :
Complementary Index
Journal :
Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International
Publication Type :
Conference
Accession number :
81451477
Full Text :
https://doi.org/10.1109/IMPACT.2010.5699599
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