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Influence of surface morphology on the adhesion strength of plated Cu on the build-up layer within an embedded active package.
- Source :
- Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p
- Publication Year :
- 2010
Details
- Language :
- English
- ISBNs :
- 9781424497836
- Database :
- Complementary Index
- Journal :
- Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International
- Publication Type :
- Conference
- Accession number :
- 81451473
- Full Text :
- https://doi.org/10.1109/IMPACT.2010.5699595