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Characteristics of electrically conductive adhesives filled with copper nanoparticles with organic layer.

Authors :
Ho, L.-N.
Nishikawa, H.
Takemoto, T.
Kashiwagi, Y.
Yamamoto, M.
Nakamoto, M.
Source :
2009 European Microelectronics & Packaging Conference; 2009, p1-4, 4p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424447220
Database :
Complementary Index
Journal :
2009 European Microelectronics & Packaging Conference
Publication Type :
Conference
Accession number :
81440741

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