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Thermo mechanical characterization of packaging polymers.

Authors :
Boehme, B.
Jansen, K.M.B.
Rzepka, S.
Wolter, K.-J.
Source :
2009 European Microelectronics & Packaging Conference; 2009, p1-10, 10p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424447220
Database :
Complementary Index
Journal :
2009 European Microelectronics & Packaging Conference
Publication Type :
Conference
Accession number :
81440690

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