Improved ball-on-elastic-pad and ball-on-hole tests for silicon die strength.

Authors :: Huang, P.S.
Tsai, M.Y.
Source :: 2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p518-521, 4p
Publication Year :: 2009

Language :: English
ISBNs :: 9781424443413
Database :: Complementary Index
Journal :: 2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference
Publication Type :: Conference
Accession number :: 81411960
Full Text :: https://doi.org/10.1109/IMPACT.2009.5382233