Effect of micro-texture of electroplated copper thin-films on their mechanical and electrical reliability.

Details

Language :

English

ISBNs :

9781424443413

Database :

Complementary Index

Journal :

2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference

Publication Type :

Conference

Accession number :

81411938

Full Text :

https://doi.org/10.1109/IMPACT.2009.5382211