An innovative surrogate chip for accurate high-speed wire bond package measurement.

Details

Language :

English

ISBNs :

9781424485604

Database :

Complementary Index

Journal :

2010 12th Electronics Packaging Technology Conference (EPTC)

Publication Type :

Conference

Accession number :

81373728

Full Text :

https://doi.org/10.1109/EPTC.2010.5702670