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Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages.
- Source :
- Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-6, 6p
- Publication Year :
- 2010
Details
- Language :
- English
- ISBNs :
- 9781424485536
- Database :
- Complementary Index
- Journal :
- Electronic System-Integration Technology Conference (ESTC), 2010 3rd
- Publication Type :
- Conference
- Accession number :
- 81373201
- Full Text :
- https://doi.org/10.1109/ESTC.2010.5642997