Fan-Out Wafer-Level Packaging with highly flexible design capabilities.

Authors :: Kurita, Y.
Kimura, T.
Shibuya, K.
Kobayashi, H.
Kawashiro, F.
Motohashi, N.
Kawano, M.
Source :: Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-6, 6p
Publication Year :: 2010

Language :: English
ISBNs :: 9781424485536
Database :: Complementary Index
Journal :: Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Publication Type :: Conference
Accession number :: 81373092
Full Text :: https://doi.org/10.1109/ESTC.2010.5642888