The thermal stability of Ni and Ni/Au ohmic contacts to n-type 4H-SiC.

Authors :: Kim, B.K.
Burm, J.
An, C.
Source :: 12th International Conference on Semiconducting & Insulating Materials, 2002. SIMC-XII-2002; 2002, p97-101, 5p
Publication Year :: 2002

Language :: English
ISBNs :: 9780780374188
Database :: Complementary Index
Journal :: 12th International Conference on Semiconducting & Insulating Materials, 2002. SIMC-XII-2002
Publication Type :: Conference
Accession number :: 81334044
Full Text :: https://doi.org/10.1109/SIM.2002.1242733