Pre bonding metrology solutions for 3D integration.

Authors :: Riou, G.
Gaudin, G.
Landru, D.
Tempesta, C.
Radu, I.
Sadaka, M.
Winstel, K.
Kinser, E.
Hannon, R.
Kamenev, B.V.
Darwin, M.
Sachs, R.
Source :: 3D Systems Integration Conference (3DIC), 2010 IEEE International; 2010, p1-5, 5p
Publication Year :: 2010

Language :: English
ISBNs :: 9781457705267
Database :: Complementary Index
Journal :: 3D Systems Integration Conference (3DIC), 2010 IEEE International
Publication Type :: Conference
Accession number :: 81316146
Full Text :: https://doi.org/10.1109/3DIC.2010.5751484