Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D ...

Authors :: Reed, J.D.
Goodwin, S.
Gregory, C.
Temple, D.
Source :: 3D Systems Integration Conference (3DIC), 2010 IEEE International; 2010, p1-8, 8p
Publication Year :: 2010

Language :: English
ISBNs :: 9781457705267
Database :: Complementary Index
Journal :: 3D Systems Integration Conference (3DIC), 2010 IEEE International
Publication Type :: Conference
Accession number :: 81316096
Full Text :: https://doi.org/10.1109/3DIC.2010.5751434

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