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Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders.

Authors :
Kochetov, R.
Andritsch, T.
Lafont, U.
Morshuis, P.H.F.
Picken, S.J.
Smit, J.J.
Source :
2009 IEEE Electrical Insulation Conference; 2009, p524-528, 5p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424439157
Database :
Complementary Index
Journal :
2009 IEEE Electrical Insulation Conference
Publication Type :
Conference
Accession number :
81311518
Full Text :
https://doi.org/10.1109/EIC.2009.5166402