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Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders.
- Source :
- 2009 IEEE Electrical Insulation Conference; 2009, p524-528, 5p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424439157
- Database :
- Complementary Index
- Journal :
- 2009 IEEE Electrical Insulation Conference
- Publication Type :
- Conference
- Accession number :
- 81311518
- Full Text :
- https://doi.org/10.1109/EIC.2009.5166402