Stress characterization of electroplated gold layers for low temperature surface micromachining.

Details

Language :

English

ISBNs :

9780780370661

Database :

Complementary Index

Journal :

Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS 2003

Publication Type :

Conference

Accession number :

81282645

Full Text :

https://doi.org/10.1109/DTIP.2003.1287077