Cite

Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology.

MLA

Chakraborty, S., et al. “Development of an Integrated Bluetooth RF Transceiver Module Using Multi-Layer System on Package Technology.” Proceedings RAWCON 2001. 2001 IEEE Radio & Wireless Conference (Cat.No.01EX514), Jan. 2001, pp. 117–20. EBSCOhost, https://doi.org/10.1109/RAWCON.2001.947550.



APA

Chakraborty, S., Lim, K., Sutono, A., Chen, E., Yoo, S., Obatoyinbo, A., & Laskar, J. (2001). Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology. Proceedings RAWCON 2001. 2001 IEEE Radio & Wireless Conference (Cat.No.01EX514), 117–120. https://doi.org/10.1109/RAWCON.2001.947550



Chicago

Chakraborty, S., K. Lim, A. Sutono, E. Chen, S. Yoo, A. Obatoyinbo, and J. Laskar. 2001. “Development of an Integrated Bluetooth RF Transceiver Module Using Multi-Layer System on Package Technology.” Proceedings RAWCON 2001. 2001 IEEE Radio & Wireless Conference (Cat.No.01EX514), January, 117–20. doi:10.1109/RAWCON.2001.947550.