The enabling solution of Cu/low-k planarization technology.

Authors :: Wada, Y.
Noji, I.
Kobata, I.
Kohama, T.
Fukunaga, A.
Tsujimura, M.
Source :: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005; 2005, p126-128, 3p
Publication Year :: 2005

Language :: English
ISBNs :: 9780780387522
Database :: Complementary Index
Journal :: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005
Publication Type :: Conference
Accession number :: 81248757
Full Text :: https://doi.org/10.1109/IITC.2005.1499951