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BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules.
- Source :
- Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005; 2005, p9-11, 3p
- Publication Year :
- 2005
Details
- Language :
- English
- ISBNs :
- 9780780387522
- Database :
- Complementary Index
- Journal :
- Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005
- Publication Type :
- Conference
- Accession number :
- 81248710
- Full Text :
- https://doi.org/10.1109/IITC.2005.1499904