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Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration.
- Source :
- Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729); 2004, p239-241, 3p
- Publication Year :
- 2004
Details
- Language :
- English
- ISBNs :
- 9780780383081
- Database :
- Complementary Index
- Journal :
- Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)
- Publication Type :
- Conference
- Accession number :
- 81248473
- Full Text :
- https://doi.org/10.1109/IITC.2004.1345761