"Sea of Kelvin" multiple-pattern arrangement interconnect characterization for low-k/Cu dual damascene and its findings.

Details

Language :

English

ISBNs :

9780780383081

Database :

Complementary Index

Journal :

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)

Publication Type :

Conference

Accession number :

81248461

Full Text :

https://doi.org/10.1109/IITC.2004.1345749