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A 7 level metallization with Cu damascene process using newly developed abrasive free polishing.
- Source :
- Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p264-266, 3p
- Publication Year :
- 2000
Details
- Language :
- English
- ISBNs :
- 9780780363274
- Database :
- Complementary Index
- Journal :
- Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
- Publication Type :
- Conference
- Accession number :
- 81247464
- Full Text :
- https://doi.org/10.1109/IITC.2000.854343