Complete-abrasive-free process for copper damascene interconnection.

Authors :: Kondo, S.
Sakuma, N.
Homma, Y.
Goto, Y.
Ohashi, N.
Yamaguchi, H.
Owada, N.
Source :: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p253-255, 3p
Publication Year :: 2000

Language :: English
ISBNs :: 9780780363274
Database :: Complementary Index
Journal :: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
Publication Type :: Conference
Accession number :: 81247461
Full Text :: https://doi.org/10.1109/IITC.2000.854340