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Overview of Cu/low K technology failure analysis and reliability issues.

Authors :
Huixian Wu
Cargo, J.
Seier, A.
Source :
Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2003); 2003, p5-11, 7p
Publication Year :
2003

Details

Language :
English
ISBNs :
9780780377226
Database :
Complementary Index
Journal :
Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2003)
Publication Type :
Conference
Accession number :
81227698
Full Text :
https://doi.org/10.1109/IPFA.2003.1222711