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Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP.
- Source :
- EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems; 2006, p1-7, 7p
- Publication Year :
- 2006
Details
- Language :
- English
- ISBNs :
- 9781424402755
- Database :
- Complementary Index
- Journal :
- EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems
- Publication Type :
- Conference
- Accession number :
- 81134412
- Full Text :
- https://doi.org/10.1109/ESIME.2006.1643969