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A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devices.

Authors :
Chung, S.S.
Liu, Y.R.
Yeh, C.F.
Wu, S.R.
Lai, C.S.
Chang, T.Y.
Ho, J.H.
Liu, C.Y.
Huang, C.T.
Tsai, C.T.
Source :
2005 Digest of Technical Papers. 2005 Symposium on VLSI Technology; 2005, p86-87, 2p
Publication Year :
2005

Details

Language :
English
ISBNs :
9784900784000
Database :
Complementary Index
Journal :
2005 Digest of Technical Papers. 2005 Symposium on VLSI Technology
Publication Type :
Conference
Accession number :
81129027
Full Text :
https://doi.org/10.1109/.2005.1469222