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Process integration of CVD Cu seed using ALD Ru glue layer for sub-65nm Cu interconnect.

Authors :
Choi, S.-M.
Park, K.-C.
Suh, B.-S.
Kim, I.-R.
Kang, H.-K.
Suh, K.-P.
Park, H.-S.
Ha, J.-S.
Joo, D.-K.
Source :
2004 Digest of Technical Papers. 2004 Symposium on VLSI Technology; 2004, p64-65, 2p
Publication Year :
2004

Details

Language :
English
ISBNs :
9780780382893
Database :
Complementary Index
Journal :
2004 Digest of Technical Papers. 2004 Symposium on VLSI Technology
Publication Type :
Conference
Accession number :
81128784
Full Text :
https://doi.org/10.1109/VLSIT.2004.1345395
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