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A mechanics-based strain gage methodology for solder joint reliability assessment.
- Source :
- Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004; 2004, p533-541, 9p
- Publication Year :
- 2004
Details
- Language :
- English
- ISBNs :
- 9780780384200
- Database :
- Complementary Index
- Journal :
- Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004
- Publication Type :
- Conference
- Accession number :
- 81105239
- Full Text :
- https://doi.org/10.1109/ESIME.2004.1304088