Reliability improvement study of a build-up wire bonding EBGA package using eight-layer 0.13 /spl mu/m copper silicon technology.

Details

Language :

English

ISBNs :

9781424401529

Database :

Complementary Index

Journal :

56th Electronic Components & Technology Conference 2006

Publication Type :

Conference

Accession number :

81104188

Full Text :

https://doi.org/10.1109/ECTC.2006.1645919