Direct bump-on-copper process for flip chip technologies.

Authors :: Jamin Ling
Sanchez, J.
Moyer, R.
Bachman, M.
Stepniak, D.
Elenius, P.
Source :: 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p704-710, 7p
Publication Year :: 2002

Language :: English
ISBNs :: 9780780374300
Database :: Complementary Index
Journal :: 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345)
Publication Type :: Conference
Accession number :: 81103329
Full Text :: https://doi.org/10.1109/ECTC.2002.1008175