Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization.

Details

Language :

English

ISBNs :

9781424444755

Database :

Complementary Index

Journal :

2009 59th Electronic Components & Technology Conference

Publication Type :

Conference

Accession number :

81068501

Full Text :

https://doi.org/10.1109/ECTC.2009.5074222