Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints.

MLA

Hutter, M., et al. “Effects of Additional Elements (Fe, Co, Al) on SnAgCu Solder Joints.” 2009 59th Electronic Components & Technology Conference, Jan. 2009, pp. 54–60. EBSCOhost, https://doi.org/10.1109/ECTC.2009.5073996.

APA

Hutter, M., Schmidt, R., Zerrer, P., Rauschenbach, S., Wittke, K., Scheel, W., & Reichl, H. (2009). Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints. 2009 59th Electronic Components & Technology Conference, 54–60. https://doi.org/10.1109/ECTC.2009.5073996

Chicago

Hutter, M., R. Schmidt, P. Zerrer, S. Rauschenbach, K. Wittke, W. Scheel, and H. Reichl. 2009. “Effects of Additional Elements (Fe, Co, Al) on SnAgCu Solder Joints.” 2009 59th Electronic Components & Technology Conference, January, 54–60. doi:10.1109/ECTC.2009.5073996.