Understanding Strain Effects on Double-Gate FinFET Drive-Current Enhancement, Hot-Carrier Reliability and Ring-Oscillator Delay Performance via Uniaxial Wafer Bending Experiments.

Details

Language :

English

ISBNs :

9781424416141

Database :

Complementary Index

Journal :

2008 International Symposium on VLSI Technology, Systems & Applications (VLSI-TSA)

Publication Type :

Conference

Accession number :

81052122

Full Text :

https://doi.org/10.1109/VTSA.2008.4530848