The high frequency parasitic effect characterization of packages with test chip inside.

Details

Language :

English

ISBNs :

9781424436200

Database :

Complementary Index

Journal :

2008 International Conference on Electronic Materials & Packaging

Publication Type :

Conference

Accession number :

81043300

Full Text :

https://doi.org/10.1109/EMAP.2008.4784254