Fatigue strength of electroplated copper thin films under uni-axial stress.

Authors :: Murata, N.
Tamakawa, K.
Suzuki, K.
Miura, H.
Source :: 2008 International Conference on Electronic Materials & Packaging; 2008, p41-44, 4p
Publication Year :: 2008

Language :: English
ISBNs :: 9781424436200
Database :: Complementary Index
Journal :: 2008 International Conference on Electronic Materials & Packaging
Publication Type :: Conference
Accession number :: 81043270
Full Text :: https://doi.org/10.1109/EMAP.2008.4784224