Use of bidirectional current stress for in depth analysis of electromigration mechanism.

Details

Language :

English

ISBNs :

9781424420490

Database :

Complementary Index

Journal :

2008 IEEE International Reliability Physics Symposium

Publication Type :

Conference

Accession number :

81020882

Full Text :

https://doi.org/10.1109/RELPHY.2008.4558986