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Drop test reliability of lead-free chip scale packages.

Authors :
farris, A.
Jianbiao Pan
Liddicoat, A.
Toleno, B.J.
Maslyk, D.
Dongkai Shangguan
Bath, J.
Willie, D.
Geiger, D.A.
Source :
2008 58th Electronic Components & Technology Conference; 2008, p1173-1180, 8p
Publication Year :
2008

Details

Language :
English
ISBNs :
9781424422302
Database :
Complementary Index
Journal :
2008 58th Electronic Components & Technology Conference
Publication Type :
Conference
Accession number :
80980928
Full Text :
https://doi.org/10.1109/ECTC.2008.4550124
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