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2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions.

Authors :
June Sub Hwang
Kumar, B.S.
Jeong Tak Moon
Chul Uhm
Yu Na Kim
Sivakumar, M.
Song Keng Yew, J.
Source :
2008 10th Electronics Packaging Technology Conference; 2008, p795-799, 5p
Publication Year :
2008

Details

Language :
English
ISBNs :
9781424421176
Database :
Complementary Index
Journal :
2008 10th Electronics Packaging Technology Conference
Publication Type :
Conference
Accession number :
80949840
Full Text :
https://doi.org/10.1109/EPTC.2008.4763529