Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moir?

Details

Language :

English

ISBNs :

9781424421176

Database :

Complementary Index

Journal :

2008 10th Electronics Packaging Technology Conference

Publication Type :

Conference

Accession number :

80949815

Full Text :

https://doi.org/10.1109/EPTC.2008.4763504